Copper Pillar(Cu Pillar) ,Copper Post(Cu Post) ,Copper Column(Cu Column)
Our high-precision processing technology makes use of in-house made equipment and dies, enabling processing with stable dimensional accuracy, and can handle monthly production rates from hundreds of millions up to tens of billions.


Product features



Our Cu pillars / posts / pins are used in various ways and applications: a) in semiconductor packages with a PoP structure (package on package), as used in high-speed communication devices like smartphones or other mobile 5G devices, b) as an interconnect or interposer for a board with built-in components, c) in combination with solder balls or plating serving as a new technology to replace bumps.
As the density of semiconductor chips increases, the number of terminals is also increasing. To respond to this trend, and to deal with smaller pitches, minuscule copper terminals can be affixed like pillars to substitute for conventional solder bumps used to connect the semiconductor chip and package interposer.
There are two methods, using plating to create copper pillars, posts, or pins and mechanically arranging micro-terminals. At our company, we use our long years of experience manufacturing the micro-terminals to offer high-precision micro-terminals for use as Copper Pillars(Cu Pillars),Copper Column(Cu Column),Copper Chip(Cu Chip).
Related products: Ultra-small pins, extra-fine pins, micro pins
We use our experience in remaining the world PGA Pins (Terminals for CPUs) market leader to attain high quality and large manufacturing capacity.
Comparison of Cu pillar pins, solder balls and plating laminates
Copper pillar | Solder ball | Plating laminates | |
---|---|---|---|
Height Pitch |
H:Flexible![]() P : Narrower pitch possible than with solder ball of same size |
H<P possible Narrow pitch not possible ![]() Only with same height(H) and pitch (P) |
H>P possible Narrow pitch possible ![]() |
Connection | Strong (surface contact) ![]() |
Weak (surface contact) ![]() |
Strong (surface contact) ![]() |
Shape | Choosable (straight,T-shape,etc) ![]() |
Ball shape only![]() |
Cylindrical ※In case of lamination only cylindrical shape ![]() |
Reference standards
φ0.06mm~(straight pin, single-header pin (T-pin))
Regarding questions about wire diameter, diameter below flange, flange thickness, aspect comparison, or any other diameter related topics, please contact us.

Shapes
Straight type Cu pin (cylinder) Header type Cu pin (T-pin)
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Main applications
a) As an interconnect Cu pin / post / column within semiconductor packages
b) PoP (Package on package), FOWLP (Fan-out wafer level package), SiP (System in Package), SoC (System on Chip), 2.5D / 3D package and more
c) As an connector terminal or pin for interposers for all types of semiconductor IC packages.
Material
Cu-based metals, copper alloys
Plating / surface treatment specifications
Sn, Ni, Au, SAC305 and more
- * Specifications, materials, and other details are available upon request.