World’s top manufacturer of copper pillars, copper posts, copper pins, and other ultra-small micro pins
Our company has a world-class mass-production system for headed parts, employing 2000 in-house automated processing machines. By using plastic working technology for metal wire we have accumulated in the roughly 50 years since our founding, we can handle virtually any part that can be manufactured through header processing, from micro pins with a wire diameter of φ100μm or less, to large headed parts for automotive applications.
We have achieved the top market share in the world in PGA terminals for the CPUs of mobile devices, laptop computers, servers, and other systems. In this field, we produce over 10 billion units a month, and we have always maintained stable high quality.
By exploiting the ultra-small and minute metal header processing technology we have accumulated in this way over many years, we offer the ultra-small terminals and micro pins, such as the copper pillars, copper posts, and copper pins, used in application processors for smartphones and other devices.
φ0.06 mm–(φ60 μm)
Header form, straight form
Copper, copper alloy, etc. (gold-plated types are also available)
These are used in the contacts, current-carrying parts and other points of semiconductors, IC chips, and electronic components.
Related products: Copper Pillars(Cu Pillars), Copper Column(Cu Column)
Advantages of using Cu pillar
Compared with solder balls or the layered plating system, Cu pillars have the following advantages for use.
Compared with solder balls, Cu pillars enable a narrower pitch.
Compared to solder balls, Cu pillars have stable height and a greater degree of freedom in height design.
L dimension measurement data *Stable within ±5μm
Compared with the layered plating system, production speed is quick and quality is stable.
Rely on Finecs for ultra-small pins, micro pins, Cu pillars, copper pins, copper post pins and other headed parts.