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Copper Pillar pin

Our Copper Pillar pins are used in various ways and applications:
a) in semiconductor packages with a PoP structure (package on package), as used in high-speed communication devices like smartphones or other mobile 5G devices,
b) as an interconnect or interposer for a board with built-in components,
c) in combination with solder balls or plating serving as a new technology to replace bumps.

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Reference standardsφ0.06mm～
MaterialCu-based metals, copper alloys
Plating / surface treatment specificationsSn, Ni, Au, SAC305 and more
ShapesStraight type Cu pin (cylinder) , Header type Cu pin (T-pin)

Main applications

As an interconnect within semiconductor packages

PoP (Package on package), FOWLP (Fan-out wafer level package), SiP (System in Package), SoC (System on Chip), 2.5D / 3D package and more. As an connector terminal or pin for interposers for all types of semiconductor IC packages.

What is Copper Pillar pin?

There are two main methods for Copper Pillar pin processing: one involves stacking copper (Cu) pillars through plating, and the other arranges micro terminal pins. Leveraging our long-standing expertise in manufacturing micro terminal pins, we can stably supply high-precision micro terminals—micro pins—that can be used as copper pillars (Cu Pillar), copper posts (Cu Post), or copper pins.
To accommodate the increasing number of terminals resulting from the higher integration of semiconductor chips, we replace conventional solder bumps, solder balls, and plated copper posts with micro-diameter copper (Cu) pins arranged in cylindrical post shapes. These serve as electrical interconnections and interposers for semiconductor chips and packages.
This approach enables narrower pitch designs while allowing flexible height configurations. Furthermore, by transitioning from point contact to surface contact, we achieve enhanced bonding strength.

Comparison of Copper Pillar pins, solder balls and plating laminates

Copper pillar pinSolder ballPlating laminates
Height
Pitch		H:Flexible
P : Narrower pitch possible than with solder ball of same size
H＜P possible
Narrow pitch not possible
Only with same height(H) and pitch (P)
H＞P possible
Narrow pitch possible)
ConnectionStrong
(surface contact)
Weak
(surface contact)
Strong
(surface contact)
Shape
Choosable
(straight,T-shape,etc)
Ball shape only
Cylindrical
※In case of lamination only cylindrical shape

* Specifications, materials, and other details are available upon request.

Related Links

Basic Information Page on Copper Pillar pins
Ultra-small pins, extra-fine pins, micro pins
PGA Pins (Terminals for CPUs)

Frequently Asked Questions about this Product

  • About copper pillar, how do you manufacture it?

    Our original equipment is manufactured by press-forming (cold forging) which processes wire materials by methods such as cutting and tapping.

Products with the Same Shape

Products with the Same Processing Method