Plungers for Contact Probes

Our plunger products for probes are recommended for the following customers!

  • Those who are promoting eco-friendly activities and are looking for an environmentally friendly plunger.
  • Those who are having difficulty finding a plunger with the specifications they want.
  • Those who are looking for a plunger with high conductivity or high thermal conductivity material.
  • Those who want to eliminate probe sharp edges.

Features of our probe products

Cold forging process of wire rods allows the material to be used without wasting, which is eco-friendly because it does not generate chips due to cutting process.

To Cold forging process page >

Unique shape by forging process

Advantages and disadvantages of cold forging >

As process is using plastic deformation by pressuring material with the metal die, hating duration is extremely short and does not damage the characteristics of the material, so that mass quantity production is available

Since pressure is applied to the material in the mold to induce plastic deformation, heat generated by the process is extremely short-lived and does not damage the properties of the material, enabling mass production.

Image of forging process replacement from cutting

lineup

For wire probes
Partially flattened plunger
Specifications
Wire diameter φ0.1mm~
Total length 2~60mm
Material C2600
C2700
C5191
Others
Shape of flattened portion Flat
Star
Tip shape Needle flat
Plating Ni base + Au
Packing form Bag
Case
For Contact Probes
Header processing plunger
Specifications
Wire diameter φ0.05mm~
Total length 2~20mm
Material C2600
C2700
C5191
Others
Tip shape Round
Flat
Round Flat
Needle Flat
Concave
Plating Ni Base + Au
Packing form Bag
case
Mid-flanged Plunger
Specifications
Wire diameter φ0.05mm~
Total length 2~10mm
Material C2600
C2700
C5191
Others
Mid-flanged Single
Double
Tip shape Flat
Earl Flat
Needle Flat
Plating Ni base + Au
Packing form bag

For Spring Connectors
For Spring Connectors
Specifications
Wire diameter φ0.2mm~
Total length 1~6mm
Material C2600
C2700
C5191
Others
Tip shape Round
Plating Ni base + Au
Packing form bag

Tip Shape

Shape Round Needle Flat Concave Flat
Figure
Features Suitable for inspection with less damage to vulnerable contact surfaces. Suitable for inspection of fine contact points due to the narrow tip. Suitable for inspection by contact with solder balls. Suitable for surface contact inspection.

Material

Physical Properties
component C2600 C2700 C5191 Highly conductive material
Specific gravity 8.53 8.47 8.83 Please inquire
thermal expansion coefficient[10-6/K] 19.9 20.3 18.0
Thermal Conductivity[W/(m/K)] 121 117 67
Conductivity[%IACS] 28 27 14
Modulus of Longitudinal Elasticity[GPa] 110 103 110
化学成分
component C2600 C2700 C5191 Highly conductive material
Cu[wt%] 68.5~71.5 63.0~67.0 Remaining portion Please inquire
Pb[wt%] ≦0.05 ≦0.05 ≦0.02
Fe[wt%] ≦0.05 ≦0.05 ≦0.1
Zn[wt%] Remaining portion Remaining portion ≦0.2
Sn[wt%] - - 5.5~7.0
P[wt%] - - 0.03~0.35

Main Applications

Semiconductor inspection equipment related

Inspection contact probe applications (spring probes, probe pins)
Contact probes for inspection measuring machines and inspection sockets for various electronic components, semiconductor devices, printed circuit boards, etc.

Consumer and industrial products

Spring connector applications (pogo pins)
Contact probes for inspection measuring machines and inspection sockets for smartphones, semiconductor devices, printed circuit boards, etc.