What you will find in this document
At FINECS, we produce and sell Cu pillars with a diameter ranging from 60μm to several 100μm, perfectly suitable for mounting on next-generation 2.5D or 3D packages with small pitches.
Our high-precision processing technology makes use of in-house made equipment and dies, enabling processing with stable dimensional accuracy, and can handle monthly production rates from hundreds of millions up to tens of billions.
This document compares the features of Cu pillars with those of solder balls and layered plating, and introduces the advantages of Cu pillars.
Please take a look at this document.
Recommended for
・Looking for a supplier of order ultra-small terminal processing.
・Would like to know the features of Cu pillars and what advantages they have.