Terminals with solder

This product is manufactured and sold by FINECS.

  • Terminals with solder
  • Terminals with solder

Available sizes, shapes, etc.

φ0.3 mm and above (shank diameter)

Surface treatment

Silver-plated copper wire, nickel-plated copper wire, etc.

Product features

These products have solder pressure-bonded on the center of the head surface, which allows easy solder jointing of electronic parts or chip components with each other, or onto substrates. Since the pressure-bonded solder is accurately positioned, the parts can be bonded in a well-balanced way.

* Specifications, materials, and other details are available upon request.

Please contact FINECS for details.