Terminals with solder
This product is manufactured and sold by FINECS.
Available sizes, shapes, etc.
φ0.3 mm and above (shank diameter)
Surface treatment
Silver-plated copper wire, nickel-plated copper wire, etc.
Product features
These products have solder pressure-bonded on the center of the head surface, which allows easy solder jointing of electronic parts or chip components with each other, or onto substrates. Since the pressure-bonded solder is accurately positioned, the parts can be bonded in a well-balanced way.
* Specifications, materials, and other details are available upon request.