Terminals with solder

These products have solder pressure-bonded on the center of the head surface, which allows easy solder jointing of electronic parts or chip components with each other, or onto substrates. Since the pressure-bonded solder is accurately positioned, the parts can be bonded in a well-balanced way.

Request a quote or prototype
Reference standardsφ0.3mm~
Surface treatmentSilver-plated copper wire, nickel-plated copper wire, etc.

* Specifications, materials, and other details are available upon request.

Related Link