Plungers for Contact Probes

Our plunger products for probes are recommended for the following customers!
・Those who are promoting eco-friendly activities and are looking for an environmentally friendly plunger.
・Those who are having difficulty finding a plunger with the specifications they want.
・Those who are looking for a plunger with high conductivity or high thermal conductivity material.
・Those who want to eliminate probe sharp edges.

Request a quote or prototype

Main Applications

Semiconductor inspection equipment related

Inspection contact probe applications (spring probes, probe pins)
Contact probes for inspection measuring machines and inspection sockets for various electronic components, semiconductor devices, printed circuit boards, etc.

Consumer and industrial products

Spring connector applications (pogo pins)
Contact probes for inspection measuring machines and inspection sockets for smartphones, semiconductor devices, printed circuit boards, etc.

lineup

Machining Examples①

Specifications
Wire diameter	φ0.2mm～φ0.6mm
Total length	5.0mm～10.0mm
Material	C2600
	C2700
	C5191
	Others
Tip shape	Needle flat
Plating	Ni base + Au
Packing form	Bag
Packing form	Case

Machining Examples②

Specifications
Wire diameter	φ0.3mm～φ.8mm
Total length	5.0mm～15.0mm
Material	C2600
	C2700
	C5191
	Others
Tip shape	Flat
	Round Flat
	Needle flat
	Concave
Plating	Ni base + Au
Packing form	Bag
Packing form	Case

Machining Examples③

Specifications
Wire diameter	φ0.2mm～φ1.0mm
Total length	5.0mm～10.0mm
Material	C2600
	C2700
	C5191
	Others
Mid-flanged	Single
Mid-flanged	Double
Tip shape	Flat
Plating	Ni base + Au
Packing form	Bag

Machining Examples④

Specifications
Wire diameter	φ0.15mm～φ0.8mm
Total length	0.5mm～3.0mm
Material	C2600
	C2700
	C5191
	Others
Tip shape	Round
Plating	Ni base + Au
Packing form	Bag

Tip Shape

Material

Physical Properties

component	C2600	C2700	C5191	Highly conductive material
Specific gravity	8.53	8.47	8.83	Please inquire
thermal expansion coefficient[10-6/K]	19.9	20.3	18.0
Thermal Conductivity[W/(m/K)]	121	117	67
Conductivity[%IACS]	28	27	14
Modulus of Longitudinal Elasticity[GPa]	110	103	110

Chemical Properties

component	C2600	C2700	C5191	Highly conductive material
Cu[wt%]	68.5~71.5	63.0~67.0	Remaining portion	Please inquire
Pb[wt%]	≦0.05	≦0.05	≦0.02
Fe[wt%]	≦0.05	≦0.05	≦0.1
Zn[wt%]	Remaining portion	Remaining portion	≦0.2
Sn[wt%]	-	-	5.5～7.0
P[wt%]	-	-	0.03～0.35

Features of our probe products

Cold forging process of wire rods allows the material to be used without wasting, which is eco-friendly because it does not generate chips due to cutting process.

To Cold forging process page　＞

Unique shape by forging process

Advantages and disadvantages of cold forging　＞

Shape	Round	Needle Flat	Concave	Flat
Figure
Features	Suitable for inspection with less damage to vulnerable contact surfaces.	Suitable for inspection of fine contact points due to the narrow tip.	Suitable for inspection by contact with solder balls.	Suitable for surface contact inspection.