Partially soft-gold plated parts・Hoop plating

Reference standards	Plate thickness t = 0.1mm ～
Material	Brass and other

Main applications

For wire bonding gold, silver or aluminum wire with a diameter of 10 to several 100 μm is used. The goal of this method is to electrically connect electrodes of a semiconductor chip with conductors on a lead frame or substrate.
Compared to soldering, wire bonding requires high reliability in tiny areas. The wire is joined and connected to the surface by heat or ultrasonic waves.
Soft-gold plating is suitable as a surface treatment for wire bonding due to its characteristics (adhesion and wettability).
In addition, because it has excellent conductivity, corrosion resistance, workability, and chemical stability, it is also suitable for either long spans where there is a large distance between the chip electrode and the lead frame, as well as for fine pitch bonding where the distance between the leads is very narrow.
The disadvantage of soft-gold plating is being more expensive than silver and aluminum, but by plating only the necessary parts, the costs for gold material can be reduced and effectively be controlled.
At FINECS, we are continuously working on research and development of our technologies to further reduce production costs, thus reaching for higher satisfaction of our customers.

We have manufacturing equipment that can consistently produce from terminal press processing to plating processing, insert molding, and automatic assembly.
This enables quick quality feedback, resulting in reduction of in-process defects and costs.
For semiconductor soft-gold plating – which requires a uniform surface condition – we deliver the quality required by our customers and are able to provide highly competitive plating.

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