SEMICONDUCTORsemiconductor
FINECS is highly regarded for its precision pins and socket products, which are indispensable in semiconductor manufacturing and testing processes.
For IC test sockets and package terminals—where nanometer-level dimensional accuracy is critical—we combine the processing precision of cold forging with advanced, stable surface treatment technologies. Our products offer reduced contact resistance, superior wear resistance, and excellent heat tolerance.
We also support probing and high-density mounting in cutting-edge semiconductor applications, backed by a proven track record with many leading global semiconductor manufacturers.
semiconductor- Product List
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Embossed Taping (terminal pins & tiny components)
Can be mounted directly onto the PCB
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U-shaped pins Pyramidal pins
Used as jumper wires
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Crank shaped pins
Featuring crank bends in the middle section
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Gold-plated parts
A product offering stable corrosion resistance, excellent electrical conductivity, and superior solderability.
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Surface Treatment (Plating)
Offers excellent solderability, corrosion resistance, and electrical conductivity
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PGA Pins (Terminals for CPUs)
Electrically connects the CPU package substrate to the socket on the motherboard
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Lead pins / Diode terminals
An electronic component with rectifying properties
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Press-fit terminals (from wire)
Eliminates the soldering process and contributes to reducing environmental impact.
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Ultra-small pins, extra-fine pins, micro pins
Used for connecting semiconductor chips to package interposers
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Plungers for Contact Probes
Eco-friendly because it does not generate chips due to cutting process.
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Copper Pillar pin
Optimum for circuit connection of advanced packaging design
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Power semiconductor terminals (press-working and surface treatment)
Manufactured through processes such as punching and bending.
