Partial Au plating

Targeting various connector components and precision contact parts, it enables continuous processing in hoop form. The plating specification includes a nickel underlayer and hard gold plating (gold-cobalt alloy, gold purity 99.7–99.8%). It is designed for hoop materials formed through press processing, featuring flat plates or three-dimensional shapes such as bends.

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More detailed description

Gold plating is applied in spot areas only where necessary, helping reduce gold usage and lower costs. A nickel barrier specification is also available to prevent solder wicking during assembly. For the nickel barrier, we use a special jig to selectively apply gold plating, creating partial nickel surfaces. The gold-plated areas are continuously monitored by an image processing system to ensure precise jig positioning.