Power semiconductor terminals (press-working and surface treatment)
Terminals for power semiconductor modules are produced through press working, including blanking and bending, and bonded with gold or aluminum wires. To ensure excellent bondability, soft gold plating is applied in-house on a nickel base layer, with partial gold plating to reduce gold usage. FINECS’ proprietary technology and enhanced quality control help minimize material costs and support the adoption of energy-saving products.
Request a quote or prototype| Reference standards | Plate thickness: 0.1 mm and above |
| Material | Brass, phosphor bronze, or other by arrangement |
| Surface treatment | Nickel for primary coating, soft gold (gold purity 99.99 %) for plating |
* Specifications, materials, and other details are available upon request.
関連リンク
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Power semiconductor terminals (press-working and surface treatment) -
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