Silver plating (Ag plating) / Silver Hoop plating / press & plating
This product is manufactured and sold by FINECS.
Characteristics of silver plating (Ag plating)
Practical used metals Silver (Ag) is well-known for its high electrical and thermal conductivity, therefore surpassing even gold and copper, which are also known for their high electrical (gold) and thermal (copper) conductivity.
Also, silver comes at lower costs than gold (as of October 2020, internal research)
Silver also offers very good soldability, which makes it a favorite plating material for connectors, lead frames or other electronic equipment semiconductors.
Silver plating further stands out in matters of cost performance, as it is cheaper than gold.
As silver plating tends to change color due to sulfides, it has to be handled separately from gold plating, which is resistant to color changes.
Our hoop plating technology we are able to offer full silver plating as well as partial silver plating.
About Ag plating
We make use of hoop-plating to treat complex-shaped pressed components with a Ag coating.
Usage of Ag plating
All kinds of electronic components, covering connectors or semiconductors from consumer to automotive sectors.
Our processes and supported products
・Hoop-plating (reel to reel)
Continuous plating of band-shaped parts
At FINECS, we use hoop-plating to provide full (Au) or partial coating (Ag).
Changing to hoop-plating can help reduce costs or stabilize product quality. Please contact us if you are considering hoop-plating.
Silver Hoop plating (Ag)
Hoop plating is used on band-shaped products via a reel-to-reel system: The product is taken from a
reel, running through the plating line and finally wrapped up on a reel again.
This way of plating secures a stable high product quality, thus making a continuous plating cycle possible.
The reel-to-reel system further enables a high level productivity.
We make use of our own plating equipment for all kinds of silver plating. It is possible to handle silver plating with or without under-plating, post treatments (e.g. anti-corrosion treatment) and more. Feel free to contact us about your desired plating specifications and conditions.
Specification
These measurements are just an image.
We offer connector terminals made by press-processing, like stamping, bending and more. We offer in-house made and ordered tooling.
According to your request, we provide surface treatment to improve “connectivity“ and “solder wettability” or make use of our partial plating technology to help reducing costs. In addition, we have an image inspection system installed to ensure the highest quality even for the smallest and thinnest parts.
- We offer full and partial plating. Transport speed can differ depending on product design.
- * Specifications, materials, and other details are available upon request.
Introduction of evaluation center
We will improve our analytical capabilities and analytical capabilities, and promote stable quality technology prototypes.It is also used for quality evaluation of mass-produced products, and scientifically quickly derives solutions.
[Main analysis equipment]
Energy Dispersive X-ray Fluorescence Film Thickness Measuring Device (XRF)
High frequency inductively coupled plasma emission spectrometer (ICP-AES)
Scanning electron microscope (SEM)
Sectional data creation device (CP)
Energy Dispersive X-ray Fluorescence Analyzer (EDX)
Fourier Transform Infrared Spectrophotometer (FT-IR)
Image Dimension Measuring Machine (LM)
