Partial Au plating
Product features
Gold plating is applied to minimum necessary areas, so that the amount of gold used can be minimized. The nickel barrier technology, which requires a high level of reliability, has also been established to provide stable electrical contacts.
More detailed description
Partial gold plating is applied on the nickel primary coating. In our continuous gold-plating line, press-formed parts in various shapes (from flat or bent shapes to complex three-dimensional shapes) are handled. The application of gold plating to minimum necessary areas serves as a solution for cost reduction. In addition, the technology of nickel barrier formation, which prevents the rising of wet solder, and the technology to improve electrical contact through surface optimization have resulted in a high level of reliability.
We have built a system to respond to all kinds of requests with regard to ultrafine products, through the introduction of image inspection equipment for monitoring quality and analysis equipment.
- * Specifications, materials, and other details are available upon request.