EMBOSSED TAPINGembossed taping
Emboss taping enables high-speed, high-precision mounting by automated mounters, significantly improving efficiency in SMT processes. FINECS’ embossed taping terminals are packaged using our proprietary emboss packaging machines, designed and manufactured in-house. We can also integrate image inspection systems and other features to meet specific customer requirements.
What is Emboss Taping?
Emboss taping involves placing terminal pins or miniature electronic components individually into recessed pockets and sealing them with tape. This packaging method allows components to be mounted directly onto PCBs by assembly machines, reducing takt time and enhancing productivity. Since each part is securely stored in its own pocket, the risk of scratches during transport is minimized. Additionally, image inspection can be performed in parallel during the emboss packaging process.
